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Electronic Packaging and Interconnectio n: Design Guidelines for Surface Mount...
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Located in: Kalamazoo, Michigan, United States
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eBay item number:134042275462
Item specifics
- Condition
- Subject
- Design
- ISBN
- 9780070595774
- Publication Name
- Design Guidelines for Surface Mount and Fine Pitch Technology
- Item Length
- 9.2in
- Publisher
- McGraw-Hill Companies, T.H.E.
- Series
- Electronic Packaging and Interconnection
- Publication Year
- 1995
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Item Height
- 0.6in
- Item Width
- 7.4in
- Item Weight
- 1 Oz
- Number of Pages
- 261 Pages
About this product
Product Information
Advances in surface mount technology have had a significant impact on the way in which electronic products are manufactured. Focusing on design for manufacturing surface mount PC boards, this text features recent breakthroughs in fine pitch and ball-grid-array devices. Step-by-step guidance for developing cost-effective products possible using SMT is also provided.
Product Identifiers
Publisher
McGraw-Hill Companies, T.H.E.
ISBN-10
0070595771
ISBN-13
9780070595774
eBay Product ID (ePID)
29624
Product Key Features
Publication Name
Design Guidelines for Surface Mount and Fine Pitch Technology
Format
Hardcover
Language
English
Series
Electronic Packaging and Interconnection
Publication Year
1995
Type
Textbook
Number of Pages
261 Pages
Dimensions
Item Length
9.2in
Item Height
0.6in
Item Width
7.4in
Item Weight
1 Oz
Additional Product Features
Lc Classification Number
Tk7868.P7.S637 1996
Edition Number
2
Copyright Date
1996
Target Audience
Scholarly & Professional
Topic
Industrial Design / Packaging, Materials Science / Metals & Alloys, Materials Science / Thin Films, Surfaces & Interfaces
Lccn
95-017264
Dewey Decimal
621.3/815
Dewey Edition
20
Illustrated
Yes
Genre
Technology & Engineering
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:134042275462
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Item location:
Kalamazoo, Michigan, United States
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