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Handbook of Fine Pitch Surface Mount Technology by Lau, John H. - Picture 1 of 1
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Handbook of Fine Pitch Surface Mount Technology by Lau, John H.

by Lau, John H. | HC | VeryGood
ThriftBooks
  • (3572557)
US $12.79
Condition:
Very Good
“May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend ”... Read moreabout condition
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eBay item number:145723231171
Last updated on May 05, 2024 14:44:04 PDTView all revisionsView all revisions

Item specifics

Condition
Very Good
A book that does not look new and has been read but is in excellent condition. No obvious damage to the cover, with the dust jacket (if applicable) included for hard covers. No missing or damaged pages, no creases or tears, and no underlining/highlighting of text or writing in the margins. May be very minimal identifying marks on the inside cover. Very minimal wear and tear. See the seller’s listing for full details and description of any imperfections. See all condition definitionsopens in a new window or tab
Seller Notes
“May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend ...
Binding
Hardcover
Weight
2 lbs
Product Group
Book
IsTextBook
No
ISBN
9780442012588
Publication Year
1993
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Handbook of Fine Pitch Surface Mount Technology
Author
John H. Lau
Item Length
9.1in
Publisher
Springer
Item Width
6.3in
Item Weight
39.2 Oz
Number of Pages
692 Pages

About this product

Product Information

Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.

Product Identifiers

Publisher
Springer
ISBN-10
0442012586
ISBN-13
9780442012588
eBay Product ID (ePID)
247936

Product Key Features

Author
John H. Lau
Publication Name
Handbook of Fine Pitch Surface Mount Technology
Format
Hardcover
Language
English
Publication Year
1993
Type
Textbook
Number of Pages
692 Pages

Dimensions

Item Length
9.1in
Item Width
6.3in
Item Weight
39.2 Oz

Additional Product Features

Number of Volumes
1 Vol.
Lc Classification Number
Tk7888.4qa76.635tj24
Copyright Date
1994
Target Audience
Scholarly & Professional
Topic
Systems Architecture / General, Industrial Design / Packaging, Materials Science / Metals & Alloys, Electronics / Circuits / General, Manufacturing
Lccn
93-025289
Illustrated
Yes
Genre
Computers, Technology & Engineering

Item description from the seller

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