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Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniqu
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Located in: Fairfield, Ohio, United States
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eBay item number:364695788543
Item specifics
- Condition
- ISBN-13
- 9781461365679
- Book Title
- Fine Pitch Surface Mount Technology
- ISBN
- 9781461365679
- Publication Year
- 2014
- Type
- Textbook
- Format
- Trade Paperback
- Language
- English
- Publication Name
- Fine Pitch Surface Mount Technology : Quality, Design, and Manufacturing Techniques
- Item Length
- 9.3in
- Publisher
- Springer
- Item Width
- 6.1in
- Item Weight
- 19.2 Oz
- Number of Pages
- Xi, 340 Pages
About this product
Product Information
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ), and theASTM (Philadelphia), cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FP
Product Identifiers
Publisher
Springer
ISBN-10
1461365678
ISBN-13
9781461365679
eBay Product ID (ePID)
203430045
Product Key Features
Publication Name
Fine Pitch Surface Mount Technology : Quality, Design, and Manufacturing Techniques
Format
Trade Paperback
Language
English
Publication Year
2014
Type
Textbook
Number of Pages
Xi, 340 Pages
Dimensions
Item Length
9.3in
Item Width
6.1in
Item Weight
19.2 Oz
Additional Product Features
Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Table of Content
1 Introduction to Fine Pitch Technology (FPT).- 1.0 Introduction.- 1.1 What is Fpt?.- 1.2 The Benefits of Fine Pitch Technology.- 1.3 The Motivation for Fine Pitch Technology.- 1.4 Comparison of Fpt with Through-Hole and Surfacemount Technologies.- 1.5 Fine Pitch Technology Obstacles and Issues.- 2 The Family of FPT Packages.- 2.0 The Evolution of Fpt Packages.- 2.1 Introduction and Construction of Fine Pitch Packages.- 2.2 Quad Flat Packages.- 2.3 Plastic Quad Flat Packages.- 2.4 Small Outline Packages.- 2.5 Tape Automated Bonded and Guard Ring Packages.- 2.6 Package Handling and Shipping.- 2.7 Package Reliability and Quality.- 2.8 Issues When Selecting an Fpt Package.- 3 Fine Pitch Product Applications.- 3.0 Applications.- 3.1 Product Applications.- 3.2 Package Usage.- 4 Printed Circuit Boards for Fine Pitch Technology.- 4.0 Basic Pcb Processing.- 4.1 Material Options and Properties.- 4.2 Fabrication and Assembly Issues.- 4.3 Composite Electrical Properties.- 4.4 Composite Thermal Properties.- 5 Solder and Application Methods.- 5.0 Solder.- 5.1 Solder Alloy Choices.- 5.2 Flux.- 5.3 Solvents and Thixotropes.- 5.4 Specifying a Paste.- 5.5 Storage.- 5.6 Paste Quality Control and Testing.- 5.7 Applying Solder Paste.- 6 Package Placement.- 6.0 Placement.- 6.1 Placement Options.- 6.2 Additional Placement System Features.- 6.3 Throughput Requirements.- 7 Solder Reflow.- 7.0 Reflow Defined.- 7.1 The Dynamics of the Reflow Process.- 7.2 The Heat Source.- 7.3 Selecting a Reflow Method.- 7.4 Changing Component Location During Reflow.- 8 Post Reflow Cleaning.- 8.1 Successful No-Clean.- 9 Inspection, Rework, and Repair.- 9.0 Inspection.- 9.1 Rework and Repair.- 10 Design for Reliability Guidelines.- 10.1 Defining Solder Joint Reliability.- 10.3 Cause of Solder Joint Fatigue.- 10.4Solder Joint Prediction Models.- 10.5 Electronic Product Use Conditions.- 10.6 General Design for Reliability Guidelines.- 11 Design for Testability.- 11.0 Basics of Electrical Testing Pcas.- 11.1 Contacting the Assembly.- 11.2 Disadvantages of In-Circuit Testing.- 11.3 Alternatives to In-Circuit Testing.- 11.4 Successfully Using Ict For Fpt Testing.- 12 Design for Manufacturability.- 12.0 General Dfm Guidelines.- 12.1 The Rules of Dfm.- 12.2 Implementing Dfm.- 12.3 Dfm Summary.- 13 Specific Design Guidelines for FPT Packages.- 13.1 Package Selection.- 13.2 Package Placement on the Board.- 13.3 Land Pattern Size.- 13.4 Trace Routing and Protection.- 13.5 Thermal Management.- 13.6 Fabrication of the Board.- 13.7 Stencil Fabrication.- Appendix A Addresses of Standards Organizations.- Appendix B Summary of SMT Semiconductor Outlines from JEDEC Publication 95.- Appendix C Summary of Important Component, Material,Process and Design Standards.
Copyright Date
1992
Topic
Industrial Design / Packaging, Hardware / General, Electronics / Circuits / Integrated, Electronics / Circuits / General, Manufacturing
Intended Audience
Scholarly & Professional
Illustrated
Yes
Genre
Computers, Technology & Engineering
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:364695788543
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Fairfield, Ohio, United States
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i***6 (139)- Feedback left by buyer.
Past 6 months
Verified purchase
Item as described, good price, well packaged, arrived slightly later than hoped (not in time for Christmas ) but the order was placed in a very busy shipping period. No issue with the seller’s speed of response and sending the item. Great seller!
t***r (91)- Feedback left by buyer.
Past 6 months
Verified purchase
I was pleasantly surprised by how soon I received this textbook given that it shipped from outside the U.S. It was packaged well with no damage. The price was right. And I greatly appreciated the communication informing me where the book was shipping from and including a tracking number. Overall, a positive experience, - online shopping the way it should be. I've bought books from this seller several times now without any complaints and will surely buy from them again. Thanks a lot!
s***3 (147)- Feedback left by buyer.
Past month
Verified purchase
Quality and hard to find book that won't be released 'til January 2025 in the U.S.A.
Fantastic price.
Book was in a secure and protective package. Arrived a few days after I placed order and that was faster than I expected.
Seller is a fantastic communicator and proactive in regards to tracking status. I'd definitely buy from them in the future.
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